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Cu-Cu hybrid bonding as option for 3D IC stacking
Publication:
Cu-Cu hybrid bonding as option for 3D IC stacking
Date
2012
Proceedings Paper
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24933.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hu, Yu-Hsiang
;
Lii, M.J.
;
Rebibis, Kenneth June
;
Jourdain, Anne
;
La Manna, Antonio
;
Beyne, Eric
;
Yu, C.H.
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2131
since deposited on 2021-10-20
Acq. date: 2025-10-27
Citations
Metrics
Views
2131
since deposited on 2021-10-20
Acq. date: 2025-10-27
Citations