Publication:

Low temperature SiCN as dielectric for hybrid bonding

Date

2023

Proceedings Paper

https://doi.org/10.1109/EDTM55494.2023.10103036

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Author(s)

Channam, Venkat Sunil Kumar

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Sepulveda Marquez, Alfonso

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Journal

N/A

Statistics

999 since deposited on 2023-09-03

Acq. date: 2026-06-05