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Low temperature SiCN as dielectric for hybrid bonding
Publication:
Low temperature SiCN as dielectric for hybrid bonding
Date
2023
Proceedings Paper
https://doi.org/10.1109/EDTM55494.2023.10103036
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Channam, Venkat Sunil Kumar
;
Iacovo, Serena
;
Walsby, Edward
;
Belov, Igor
;
Jourdain, Anne
;
Sepulveda Marquez, Alfonso
;
Beyne, Eric
Journal
N/A
Abstract
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Views
980
since deposited on 2023-09-03
Acq. date: 2025-10-25
Citations
Metrics
Views
980
since deposited on 2023-09-03
Acq. date: 2025-10-25
Citations