Publication:

Low temperature SiCN as dielectric for hybrid bonding

Date

2023
Proceedings Paper
https://doi.org/10.1109/EDTM55494.2023.10103036
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dc.contributor.authorChannam, Venkat Sunil Kumar
dc.contributor.authorIacovo, Serena
dc.contributor.authorWalsby, Edward
dc.contributor.authorBelov, Igor
dc.contributor.authorJourdain, Anne
dc.contributor.authorSepulveda Marquez, Alfonso
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChannam, Venkat Sunil Kumar
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSepulveda Marquez, Alfonso
dc.contributor.orcidimecChannam, Venkat Sunil Kumar::0000-0003-2034-4313
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSepulveda Marquez, Alfonso::0000-0003-4726-177X
dc.date.accessioned2024-03-25T15:36:18Z
dc.date.available2023-09-03T17:38:49Z
dc.date.available2023-09-07T09:56:36Z
dc.date.available2024-03-25T15:36:18Z
dc.date.issued2023
dc.identifier.doi10.1109/EDTM55494.2023.10103036
dc.identifier.eisbn979-8-3503-3252-0
dc.identifier.issn2473-2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42453
dc.publisherIEEE
dc.source.conference7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedateMAR 07-10, 2023
dc.source.conferencelocationSeoul
dc.source.journalN/A
dc.source.numberofpages3
dc.title

Low temperature SiCN as dielectric for hybrid bonding

dc.typeProceedings paper
dspace.entity.typePublication
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