Now showing items 1-2 of 2

    • 3D Si-level integration in wireless sensor node 

      van Engen, Piet; van Doremalen, Ric; Jochems, Wouter; Rommers, Ad; Cheng, Shi; Rydberg, Anders; Fritzsch, Thomas; Wolf, Jürgen; De Raedt, Walter; Muller, Philippe; Alarcon, Eduardo; Sanduleanu, Mihai (2009)
    • Wireless activity monitor using 3D integration 

      Van Doremalen, Ric; Van Engen, Piet; Jochems, Wouter; Rommers, Ad; Maas, Geert; Cheng, Shi; Rydberg, Anders; Fritzsch, Thomas; Wolf, Jürgen; De Raedt, Walter; Jansen, Roelof; Muller, Philippe; Alarcon, Eduardo; Sanduleanu, Mihai (2009)