Browsing by author "Raedschelders, E."
Now showing items 1-4 of 4
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HIPERPRINT= a board technology for high-frequency applications
De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Corlatan, D.; Raedschelders, E.; Patra, G.; Morrell, M.; Haley, C.; Schols, G.; Ostmann, A.; Mathelin, D. (2000) -
Mixed component integration in advanced printed wiring boards
O'Reilly, S.; Duffy, M.; Mathuna, S. C.; Raedschelders, E.; Corlatan, D.; Madou, An; Martens, Luc; Payne, S. (1999) -
Mixed component integration in MCM-L technology
O'Reilly, S.; Duffy, M.; Mathuna, S. C.; Madou, An; Martens, Luc; Corlatan, D.; Raedschelders, E.; De Langhe, Pascal; Langkabel, E. (1999) -
Standard SMT process for flip-chip assembly on FR4 substrate
Harris, S.; Patra, G.; Mainwaring, S.; Schols, G.; Mathelin, D.; Corlatan, D.; Raedschelders, E.; De Langhe, Pascal; De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Morrell, M; Haley, C.; Ostman, A. (2001)