Browsing by author "De Baets, Johan"
Now showing items 1-20 of 62
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3D packaging using organic laminates solutions
De Baets, Johan; Beyne, Eric (2007) -
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2012) -
A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
Mandamparambil, Rajesh; Fledderus, Henri; van den Brand, Jeroen; Saalmink, Milan; Kusters, Roel; Podprocky, Tomas; Van Steenberge, Geert; De Baets, Johan; Dietzel, Andreas (2009) -
A new approach of flip chip on board technology using SMT compatible processes
Zhang, S.; De Baets, Johan; Van Calster, Andre (1999) -
A parallel optical interconnect link with on-chip optical access
Bockstaele, Ronny; De Wilde, Michiel; Meeus, Wim; Rits, Olivier; Lambrecht, Hannes; Van Campenhout, Jan; De Baets, Johan; Van Daele, Peter; Van den Berg, Eric; Klemenc, Michaela; Eitel, Sven; Annen, Richard; Van Koetsem, Jan; Widawski, Gilles; Goudeau, Jacques; Bareel, Baudouin; Le Moine, Patrick; Fries, Reto; Straub, Peter; Marion, François; Routin, Julien; Baets, Roel (2004) -
A poly-CDSe active matrix for PNLC projection displays
Carchon, Nadine; Van Doorselaer, Geert; De Cubber, A. M.; De Baets, Johan; Van Calster, Andre; Candry, P.; Bruggeman, Jef (1997) -
a-SiN:H thin film diode for digital radiography
Popov, I.; Van Doorselaer, Geert; Van Calster, Andre; De Smet, Herbert; De Baets, Johan; Callens, F.; Boesman, E. (2000) -
a-SiN:H thin film diode for digital radiography
Popov, I.; Van Doorselaer, Geert; Van Calster, Andre; De Smet, Herbert; De Baets, Johan; Callens, F.; Boesman, E. (2001) -
Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2013) -
Advanced substrates and packages for wearable electronics and sensors
Vanfleteren, Jan; De Smet, Herbert; De Baets, Johan; Van Calster, Andre (2007-03) -
An Artificial Iris ASIC with High Voltage Liquid Crystal Driver, 10 nA Light Range Detector and 40 nA Blink Detector for LCD flicker removal
Raducanu, Bogdan; Asl, Samira Zali; Stanzione, Stefano; van Liempd, Chris; Vasquez Quintero, Andres; De Smet, Herbert; De Baets, Johan; Van Hoof, Chris; Van Helleputte, Nick (2020) -
An Artificial Iris ASIC With High Voltage Liquid Crystal Driver, 10-nA Light Range Detector and 40-nA Blink Detector for LCD Flicker Removal
Raducanu, Bogdan; Zaliasl, Samira; Stanzione, Stefano; van Liempd, Chris; Vasquez Quintero, Andres; De Smet, Herbert; De Baets, Johan; Van Hoof, Chris; Van Helleputte, Nick (2020) -
An O/E measurement probe based on an optics-extended MCM-D motherboard technology
De Pauw, Herbert; De Baets, Johan; Vanfleteren, Jan; Van Calster, Andre (2002) -
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Cauwe, M.; De Baets, Johan (2008) -
Chip-to-chip parallel optical interconnects over optical backpanels based on arrays of multimode waveguides
Bockstaele, Ronny; De Wilde, Michiel; Meeus, Wim; Sergeant, Hendrik; Rits, Olivier; Van Campenhout, Jan; De Baets, Johan; Van Daele, Peter; Dorgeuille, François; Eitel, Sven; Klemenc, Michaela; Annen, Richard; Van Koetsem, Jan; Goudeau, Jacques; Bareel, Baudouin; Fries, Reto; Straub, Peter; Marion, François; Routin, Julien; Baets, Roel (2004) -
Cost modelling for embedded component technology
De Baets, Johan; Willems, Geert; Ostmann, A.; Kriechbaum, A.; Kostner, H. (2007-06) -
Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
Vanfleteren, Jan; De Baets, Johan; Van Calster, Andre; Schols, G.; Pergoot, N.; Järvinen, E.; Aintila, A. (1999) -
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask
Siau, Sam; Degrendele, Lieven; De Baets, Johan; Van Calster, Andre (2003) -
Embedded passive components for improved power plane decoupling
Cauwe, Maarten; De Baets, Johan; Grivon, Arnaud; Stahr, Johannnes; Amedeo, Alexandre (2014) -
Excimer laser microvia technology in MCMs
Manirambona, B.; De Baets, Johan; Vervaet, A. (2002)