Browsing by author "Tsau, Yan Wen"
Now showing items 1-2 of 2
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Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
Tsau, Yan Wen; De Messemaeker, Joke; Gonzalez, Mario; Seefeldt, Marc; Beyne, Eric; De Wolf, Ingrid (2023) -
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Witters, Liesbeth; Zhang, Boyao; Seefeldt, Marc; Beyne, Eric; De Wolf, Ingrid (2022)