EISBN
979-8-3503-4597-1
ISSN
2833-8553
Conference
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal
N/A
Title
Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding
Publication type
Proceedings paper