Browsing by author "De Messemaeker, Joke"
Now showing items 1-20 of 41
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A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
Herms, Martin; Wagner, Matthias; De Messemaeker, Joke; De Wolf, Ingrid (2017) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
Wilson, Chris; De Wolf, Ingrid; Vandevelde, Bart; De Messemaeker, Joke; Ablett, James M.; Redolfi, Augusto; Simons, Veerle; Beyne, Eric; Croes, Kristof (2012) -
Composite polymer core – ceria shell abrasive particles during silicon oxide CMP
Armini, Silvia; De Messemaeker, Joke; Burtovyy, Ruslan; Luzinov, Igor; Whelan, Caroline; Moinpour, Mansour; Maex, Karen (2007) -
Correlation between Cu microstructure and TSV Cu pumping
De Messemaeker, Joke; Varela Pedreira, Olalla; Philipsen, Harold; Beyne, Eric; De Wolf, Ingrid; Van der Donck, Tom; Croes, Kristof (2014) -
Cu TSV stress: avoiding Cu protrusion and impact on devices
Beyne, Eric; De Messemaeker, Joke; Guo, Wei (2014) -
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Panchenko, Iuliana; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Beyne, Eric; Wolter, Klaus-Juergen (2014) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2014) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015) -
Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds
De Messemaeker, Joke; Kim, Soon-Wook; Stucchi, Michele; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2019) -
Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
De Messemaeker, Joke; Kim, Soon-Wook; Stucchi, Michele; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2018) -
Impact of Cu TSVs on BEOL metal and dielectric reliability
Li, Yunlong; Croes, Kristof; Nabiollahi, Nabi; Van Huylenbroeck, Stefaan; Gonzalez, Mario; Velenis, Dimitrios; Bender, Hugo; Jourdain, Anne; Pantouvaki, Marianna; Stucchi, Michele; Vanstreels, Kris; Van De Peer, Myriam; De Messemaeker, Joke; Wu, Chen; Beyer, Gerald; De Wolf, Ingrid; Beyne, Eric (2014) -
Impact of oxide liner properties on TSV Cu pumping and TSV stress
De Messemaeker, Joke; Varela Pedreira, Olalla; Moussa, Alain; Nabiollahi, Nabi; Vanstreels, Kris; Van Huylenbroeck, Stefaan; Philipsen, Harold; Verdonck, Patrick; Vandevelde, Bart; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof (2015) -
Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
De Messemaeker, Joke; Varela Pedreira, Olalla; Vandevelde, Bart; Philipsen, Harold; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof (2013) -
Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage
Cherman, Vladimir; De Messemaeker, Joke; Croes, Kristof; Dimcic, Biljana; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Interaction forces between a glass surface and ceria-modified PMMA-based abrasives for CMP measured by colloidal probe AFM
Armini, Silvia; Burtovyy, Ruslan; Moinpour, Mansour; Luzinov, Igor; De Messemaeker, Joke; Whelan, Caroline; Maex, Karen (2008) -
Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling
Nabiollahi, Nabi; Moelans, Nele; Gonzalez, Mario; De Messemaeker, Joke; Wilson, Chris; Croes, Kristof; Beyne, Eric; De Wolf, Ingrid (2014) -
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
Nabiollahi, Nabi; Moelans, Nele; Gonzalez, Mario; De Messemaeker, Joke; Wilson, Chris; Croes, Kristof; Beyne, Eric; De Wolf, Ingrid (2015)