Authors

Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt

ISSN

0026-2714

Journal

Microelectronics Reliability

Volume

79

Title

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Publication type

Journal article