Publication:

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Date

2017
Journal article
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dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorNolmans, Philip
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.date.accessioned2021-10-24T07:00:15Z
dc.date.available2021-10-24T07:00:15Z
dc.date.issued2017
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28691
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271417303013
dc.source.beginpage297
dc.source.endpage305
dc.source.journalMicroelectronics Reliability
dc.source.volume79
dc.title

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

dc.typeJournal article
dspace.entity.typePublication
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