Authors

Cherman, Vladimir; De Messemaeker, Joke; Croes, Kristof; Dimcic, Biljana; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Beyne, Eric

Conference

IEEE International Reliability Physics Symposium- IRPS

Title

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

Publication type

Proceedings paper