Publication:

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

Date

2012
Proceedings Paper
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dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorCroes, Kristof
dc.contributor.authorDimcic, Biljana
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T10:16:29Z
dc.date.available2021-10-20T10:16:29Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20453
dc.source.beginpage2B-3
dc.source.conferenceIEEE International Reliability Physics Symposium- IRPS
dc.source.conferencedate14/04/2012
dc.source.conferencelocationAnaheim, CA USA
dc.title

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

dc.typeProceedings paper
dspace.entity.typePublication
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