Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

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Authors

Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof

ISSN

0021-4922

Issue

5S

Journal

Japanese Journal of Applied Physics

Volume

54

Title

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Publication type

Journal article

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