Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

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Authors
De Messemaeker, Joke; Varela Pedreira, Olalla; Vandevelde, Bart; Philipsen, Harold; De Wolf, Ingrid; Beyne, Eric; Croes, Kristof
Conference
63rd Electronic Components and Technology Conference - ECTC
Title
Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
Publication type
Proceedings paper
Embargo date
9999-12-31
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