Publication:

Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

Date

2013
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVandevelde, Bart
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-21T07:09:39Z
dc.date.available2021-10-21T07:09:39Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22212
dc.source.beginpage586
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage591
dc.title

Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
26650.pdf
Size:
1.2 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions