Publication:

Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

Date

2013

Proceedings Paper

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Files

26650.pdf 1.2 MB

Author(s)

De Messemaeker, Joke

;

Varela Pedreira, Olalla

;

Vandevelde, Bart

;

Philipsen, Harold

;

De Wolf, Ingrid

;

;

Statistics

1879 since deposited on 2021-10-21

3last month

Acq. date: 2026-04-05