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Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
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Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping
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Date
2013
Proceedings Paper
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26650.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Messemaeker, Joke
;
Varela Pedreira, Olalla
;
Vandevelde, Bart
;
Philipsen, Harold
;
De Wolf, Ingrid
;
Beyne, Eric
;
Croes, Kristof
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Acq. date: 2025-12-16
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Metrics
Views
1873
since deposited on 2021-10-21
4
last month
1
last week
Acq. date: 2025-12-16
Citations