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Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
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Authors
Panchenko, Iuliana
;
Croes, Kristof
;
De Wolf, Ingrid
;
De Messemaeker, Joke
;
Beyne, Eric
;
Wolter, Klaus-Juergen
ISSN
0167-9317
Journal
Microelectronic Engineering
Volume
117
Title
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Publication type
Journal article
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