Publication:
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
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1888 since deposited on 2021-10-22
2last month
Acq. date: 2026-01-08
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Views
1888 since deposited on 2021-10-22
2last month
Acq. date: 2026-01-08
Citations