| dc.contributor.author | Tsau, Yan Wen | |
| dc.contributor.author | De Messemaeker, Joke | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Seefeldt, Marc | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.date.accessioned | 2024-05-06T14:35:09Z | |
| dc.date.available | 2023-10-15T17:21:19Z | |
| dc.date.available | 2024-05-06T14:35:09Z | |
| dc.date.issued | 2023 | |
| dc.identifier.issn | 2833-8553 | |
| dc.identifier.other | WOS:001058887300039 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42757.2 | |
| dc.source | WOS | |
| dc.title | Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Tsau, Yan Wen | |
| dc.contributor.imecauthor | De Messemaeker, Joke | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | De Messemaeker, Joke::0000-0002-4872-0176 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.identifier.doi | 10.1109/EuroSimE56861.2023.10100784 | |
| dc.identifier.eisbn | 979-8-3503-4597-1 | |
| dc.source.numberofpages | 5 | |
| dc.source.peerreview | yes | |
| dc.source.conference | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
| dc.source.conferencedate | APR 16-19, 2023 | |
| dc.source.conferencelocation | Graz | |
| dc.source.journal | N/A | |
| imec.availability | Published - imec | |
| dc.description.wosFundingText | This work was supported by the 3D System Integration program of imec and its partners. | |
