Browsing by author "Diekmann, C."

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3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

Zhang, Wenqi; Majeed, Bivragh; Sun, Xiao; Posada Quijano, Guillermo; Diekmann, C.; Eggs, C.; Schmidhammer, E.; De Raedt, Walter (2011)
3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance

Sun, Xiao; Posada Quijano, Guillermo; Majeed, Bivragh; Zhang, Wenqi; De Raedt, Walter; Diekmann, C.; Eggs, C.; Schmidhammer, E. (2011)