Browsing by author "Bouwstra, Siebe"
Now showing items 1-2 of 2
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Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's
Vandevelde, Bart; Jansen, Roelof; Bouwstra, Siebe; Pham, Nga; Majeed, Bivragh; Limaye, Paresh; Beyne, Eric; Tilmans, Harrie (2010) -
Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS
Zekry, Joseph; Vandevelde, Bart; Bouwstra, Siebe; Puers, Bob; Van Hoof, Chris; Tilmans, Harrie (2010-04)