Browsing by author "Lam, Kan Wai"
Now showing items 1-5 of 5
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Advanced wire bonding: bonding on copper
Ho, Meng; Lam, Kan Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, C. J.; Beyne, Eric (2002) -
Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Chen, Jian; Ho, Meng; Lam, Kan Wai; Ratchev, Petar; Stoukatch, Serguei; Beyne, Eric; Vath, C.J.; De Wolf, Ingrid (2002) -
Copper wire bonding to advanced copper back-end integrated circuits
Beyne, Eric; Ho, Meng; Stoukatch, Serguei; Lam, Kan Wai; Ratchev, Petar; Degryse, Dominiek; Vath III, C.J. (2003) -
Direct Au and Cu wire bonding on Cu/Low-k BEOL
Banda, Pedro; Ho, Meng; Whelan, Caroline; Lam, Kan Wai; Vath, C.J.; Beyne, Eric (2002) -
Fine pitch copper wire bonding on copper bond pad process optimization
Lam, Kan Wai; Ho, Meng; Stoukatch, Serguei; Ratchev, Petar; Vath, C.J.; Schervan, A.; Beyne, Eric (2002)