Browsing by author "Schacht, E."

Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics

De Geyter, N.; Morent, R.; Axisa, Fabrice; De Leersnyder, Eva; Leys, C.; Vanfleteren, Jan; De Smet, N.; Rymarczyk-Machal, M.; Schacht, E. (2007-07)

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Siau, S.; Vervaet, A.; Van Vaeck, L.; Schacht, E.; Demeter, U.; Van Calster, Andre (2005)

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Siau, S.; Vervaet, A.; Schacht, E.; Callewaert, K.; Van Calster, Andre; Degrande, S. (2005)

Controlled patterning of biomolecules on solid surfaces

Martelé, Y.; Callewaert, K.; Naessens, K.; Van Daele, Peter; Baets, Roel; Schacht, E. (2003)

Development of flexible materials for photonic optical skins

Van Gijseghem, T.; Bosman, Erwin; Van Daele, Peter; Geernaert, T.; Nasilowski, Tomasz; Ottevaere, H.; Thienpont, H.; De Volder, Michael; Reynaerts, D.; Schacht, E.; Dubruel, P. (2008-06)

Development of flexible materials for photonic optical skins

Van Gijseghem, T.; Bosman, Erwin; Van Daele, Peter; Geernaert, T.; Nasilowski, T.; Ottevaere, H.; Thienpont, H.; Devolder, M.; Reynaerts, D.; Schacht, E.; Dubruel, P. (2008-06)

Flexible materials for optical applications

Van Gijseghem, T.; Boterberg, V.; Bosman, Erwin; Van Daele, Peter; Geernaert, T.; Nasilowski, T.; Ottevaere, H.; Thienpont, H.; Ferraris, E.; Reynaerts, D.; Schacht, E.; Dubruel, P. (2008-05)

Functional polymer materials for optical applications

Van Gijseghem, T.; Van Steenberge, Geert; Van Daele, Peter; Geernaert, T.; Nasilowski, T.; Ottevaere, H.; Thienpont, H.; De Volder, M.; Reynaerts, D.; Schacht, E.; Dubruel, P. (2008-09)

Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Siau, Sam; Vervaet, A.; Van Calster, Andre; Schacht, E. (2004)

Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper

Siau, S.; Vervaet, A.; Schacht, E.; Van Calster, Andre (2005-05)

Label-free biosensors on silicon-on-insulator optical chips

De Vos, Katrien; Debacker, Peter; Claes, Tom; Girones, Jordi; De Cort, Wout; Schacht, E.; Baets, Roel; Bienstman, Peter (2009)

Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics

De Geyter, N.; Morent, R.; Axisa, Fabrice; De Smet, N.; Gengembre, L.; De Leersnyder, E.; Leys, C.; Vanfleteren, Jan; Rymarczyk-Marchal, M.; Schacht, E.; Payen, E. (2008-08)