Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

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Authors

Siau, S.; Vervaet, A.; Van Vaeck, L.; Schacht, E.; Demeter, U.; Van Calster, Andre

Issue

6

Journal

Journal of the Electrochemical Society

Volume

152

Title

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Publication type

Journal article

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