Publication:
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Date
| dc.contributor.author | Siau, S. | |
| dc.contributor.author | Vervaet, A. | |
| dc.contributor.author | Van Vaeck, L. | |
| dc.contributor.author | Schacht, E. | |
| dc.contributor.author | Demeter, U. | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.date.accessioned | 2021-10-16T05:02:13Z | |
| dc.date.available | 2021-10-16T05:02:13Z | |
| dc.date.issued | 2005 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11200 | |
| dc.source.beginpage | c442 | |
| dc.source.endpage | c455 | |
| dc.source.issue | 6 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 152 | |
| dc.title | Adhesion strength of the epoxy polymer/copper interface for use in microelectronics | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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