Now showing items 1-3 of 3

    • Design issues and cosiderations for low-cost 3D TSV IC technology 

      Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)
    • Design, verification and simulation of 3D circuit 

      Katti, Guruprasad; De Wachter, Bart; Nelis, Marc; Dehan, Morin; Cupak, Miroslav; Croes, Kris; Beeckman, Gerd; Marchal, Pol; Stucchi, Michele (2009)
    • Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions 

      Van der Plas, Geert; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Limaye, Paresh; Mercha, Abdelkarim; Stucchi, Michele; Oprins, Herman; Vandevelde, Bart; Minas, Nikolaos; Cupak, Miroslav; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Beyne, Eric; Marchal, Pol (2010-09)