Browsing by author "Tezcan, Denizs"
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Indium solder bump technology for ultra high density interconnects in hybrid image sensors
John, Joachim; De Moor, Piet; Colin, Thierry; De Kerckhove, Alex; Borgers, Tom; Hooylaerts, Peter; De Munck, Koen; Tezcan, Denizs; Van Hoof, Chris (2005-06)