Browsing by author "Yang, Z."
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Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Z.; Rivera, K.; Van der Plas, Geert; Pawlak, Bartek; England, L.; Beyne, Eric; Baelmans, M. (2020)