Browsing by author "Lee, Yeong"
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Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Gonzalez, Mario; Vanden Bulcke, Mathieu; Vandevelde, Bart; Beyne, Eric; Lee, Yeong; Harkness, Brian; Meynen, Herman (2004) -
Photopatternable silicone compositions for electronics packaging applications
Harkness, Brian R.; Gardner, Geoff B.; Alger, James S.; Cummings, Michelle R.; Princing, Jennifer; Lee, Yeong; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004)