Browsing by author "Vereeken, Maria"
Now showing items 1-8 of 8
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Electroless nickel plating bath composition and replenishment for microvia plating process
Stoukatch, Serguei; Zhang, S.; Vanfleteren, Jan; Vereeken, Maria; Van Calster, Andre; Vandecasteele, Bjorn (2000) -
HIPERPRINT= a board technology for high-frequency applications
De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Corlatan, D.; Raedschelders, E.; Patra, G.; Morrell, M.; Haley, C.; Schols, G.; Ostmann, A.; Mathelin, D. (2000) -
Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Zhang, S.; De Baets, J.; Vereeken, Maria; Vervaet, A.; Van Calster, Andre (1999) -
Standard SMT process for flip-chip assembly on FR4 substrate
Harris, S.; Patra, G.; Mainwaring, S.; Schols, G.; Mathelin, D.; Corlatan, D.; Raedschelders, E.; De Langhe, Pascal; De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Morrell, M; Haley, C.; Ostman, A. (2001) -
The fabrication and reliability of a photovia test vehicle for MCM-L applciations
Zhang, S.; Vereeken, Maria; De Baets, J.; Van Calster, Andre (1998) -
The realisation of photo-via technology using multiposit as a photo imageable dielectric
Zhang, S.; Vereeken, Maria; De Baets, J.; Van Calster, Andre; Peeters, Joris; Allaert, K. (1998) -
Two-layer silicon hybrids interconnect
Lernout, Jo; Van Calster, Andre; Vereeken, Maria; Schols, G. (1995) -
Two-layer silicon hybrids interconnect technology
Lernout, Jo; Van Calster, Andre; Vereeken, Maria; Schols, G. (1995)