Browsing by author "Lee, Y.J."
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An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Harkness, B.R.; Mohamed, M.; Meynen, H.; Vanlathem, E. (2003) -
Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Larson, L.; Harkness, B.R.; Mohamed, M.; Meynen, H. (2003)