Authors

Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Harkness, B.R.; Mohamed, M.; Meynen, H.; Vanlathem, E.

Conference

Proceedings of the 53rd Electronic Components and Technology Conference

Title

An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration

Publication type

Proceedings paper