Publication:
An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
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1930 since deposited on 2021-10-15
1last month
Acq. date: 2026-03-01
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Statistics
Views
1930 since deposited on 2021-10-15
1last month
Acq. date: 2026-03-01
Citations