Browsing by author "Wang, Yu-Shuen"
Now showing items 1-2 of 2
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Through-Silicon Via technology for 3D applications
Philipsen, Harold; Luhn, Ole; Civale, Yann; Wang, Yu-Shuen; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter (2010) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010)