Browsing by author "Wang, Yu-Shuen"

Now showing items 1-2 of 2

    • Through-Silicon Via technology for 3D applications 

      Philipsen, Harold; Luhn, Ole; Civale, Yann; Wang, Yu-Shuen; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter (2010)

    • TSV Cu plating and implications for CMP 

      Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010)