Browsing by author "De Baets, J."
Now showing items 1-16 of 16
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A new approach to flip chip on board technology using SMT compatible processes
Zhang, S.; De Baets, J.; Van Calster, Andre (1999) -
A new cost-effective TAB technology for small and medium volumes
Dravet, A.; Sechez, S.; Van Calster, Andre; De Baets, J.; Venfleteren, J.; Allaert, K.; Vetter, P.; Forrest, M.; Schols, G.; Deckelmann, K.; Wiese, J.; Cortes, E. (1995) -
A two-layer high density printed circuit board and its reliability
Zhang, S.; De Baets, J.; Van Calster, Andre (1999) -
Custom design and system integration
Van Den Steen, Jean; Van Doorselaer, Geert; De Baets, J.; Van, Calster A. (1997) -
Design of an x-Si Aactive matrix for high resolution reflective displays
De Baets, J.; Van Calster, Andre; Van Den Steen, Jean; Doorselaer, G.; Wojciechowski, Dominique; Schols, G.; Witters, Johan (1995) -
Electroless nickel-gold stud bumping on laminate for flip-chip assembly
Zang, S.; Vereecken, M.; De Baets, J.; Van Calster, Andre; Vervaet, A.; Peeters, Joris; Allaert, K. (1997) -
High density thick film multilayers with Ag-based conductors
Vrana, M.; De Baets, J.; Van Calster, Andre; Born, Ivan; Detemmerman, Danny (1998) -
Low cost high density multilayer interconnection technology
Vrana, M.; De Baets, J.; Van Calster, Andre; Born, Ivan; Detemmerman, Danny (1998) -
Low cost high-density multilayer circuits for MCM-C
Born, Ivan; Detemmerman, Danny; De Baets, J.; Van Calster, Andre (1999) -
Low cost high-density multilayer circuits for MCM-C
Born, Ivan; Detemmerman, Danny; De Baets, J.; Van Calster, Andre (1999) -
New model for the characterization and simulation of TFTs in all operating regions
De Smet, Herbert; De Baets, J.; De Cubber, A. M.; De Vos, Joeri; Van Calster, Andre; Vanfleteren, Jan (1995) -
Photovia technology: some important aspects for reliability
Zhang, S.; De Baets, J.; Van Calster, Andre; Corlatan, D.; De Langhe, Pascal; Allaert, K. (1999) -
Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Zhang, S.; De Baets, J.; Vereeken, Maria; Vervaet, A.; Van Calster, Andre (1999) -
Technology and circuit aspects of reflective PNLC microdisplays
Van Den Steen, Jean; Carchon, Nadine; Van Doorselaer, Geert; De Backere, Christof; De Baets, J.; De Smet, Herbert; De Vos, Joeri; Lernout, Jo; Vanfleteren, Jan; Van Calster, Andre (1997) -
The fabrication and reliability of a photovia test vehicle for MCM-L applciations
Zhang, S.; Vereeken, Maria; De Baets, J.; Van Calster, Andre (1998) -
The realisation of photo-via technology using multiposit as a photo imageable dielectric
Zhang, S.; Vereeken, Maria; De Baets, J.; Van Calster, Andre; Peeters, Joris; Allaert, K. (1998)