Browsing by author "Lofrano, Melina"
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A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020)