Browsing by author "Degryse, Dominiek"
Now showing items 21-27 of 27
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Parametric compact models for the 72-pins Polymer Stud Grid ArrayTM
Driessens, Evelien; Van Dooren, Sofie; Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Heerman, M.; Van Puymbroeck, Jef (2000) -
Paving the way for copper-to-copper wire bonding by thorough optimization - Oxide prevention is the key
Van Bavel, Mieke; Degryse, Dominiek; Stoukatch, Serguei; Vandevelde, Bart; Beyne, Eric (2003) -
Reliability analysis of flip chip assemblies mounted on BCB thin film layered substrates
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2000) -
Simulation of solder joint reliability for CBGA packages
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Roose, Erik; Corlatan, D. (2001) -
The Shear test as interface characterization tool applied to the Si-BCB interface
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric; Degrieck, Joris (2009) -
Transient thermal characterization of the polymer stud grid array(tm)
Driessens, Evelien; Van Dooren, Sofie; Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric (2001) -
Understanding adhesion failure in low-k dielectric stacks during chemical mechanical polishing
Iacopi, Francesca; Degryse, Dominiek; Vos, Ingrid; Patz, Michael; Maex, Karen (2004-01)