Browsing by author "Christiaens, Filip"
Now showing items 21-28 of 28
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Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
Christiaens, Filip; Beyne, Eric; Roggen, Jean; Van Puymbroeck, Jan; Heerman, M. (1997) -
Thermal modelling and characterisation of electronic components: ready-state and transient analysis
Christiaens, Filip (1998-01) -
Thermal modelling of polymer stud grid array (PSGA) package
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jan; Heerman, M.; Bergmans, J. (1998) -
Thermal modelling of the polymer stud grid array (PSGATM) steady-state analysis
Christiaens, Filip; Vandevelde, Bart; Beyne, Eric; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jef; Heerman, M.; Berghmans, Jan (1997) -
Thermo-mechanical analysis of flip chip on substrate bumps - assemblies
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K. (1997) -
Thermomechanical models for leadless solder interconnections in flip chip assemblies
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K.; Vandepitte, D.; Bergmans, J. (1998) -
Thin film polymer layers for molded smart cards, CIMID technology
Beyne, Eric; Van Hoof, Rita; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, Jan; Heermann, M.; Gouwy, G. (1994) -
Transient thermal modelling and characterisation of a hybrid component
Christiaens, Filip; Beyne, Eric (1996)