Publication:
Thermomechanical models for leadless solder interconnections in flip chip assemblies
Date
Loading...
Files
Journal
Abstract
Description
Metrics
Views
1954 since deposited on 2021-10-01
Acq. date: 2025-12-08
Citations
Metrics
Views
1954 since deposited on 2021-10-01
Acq. date: 2025-12-08
Citations