Thermomechanical models for leadless solder interconnections in flip chip assemblies

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Authors

Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Peeters, J.; Allaert, K.; Vandepitte, D.; Bergmans, J.

Issue

1

Journal

IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A

Volume

21

Title

Thermomechanical models for leadless solder interconnections in flip chip assemblies

Publication type

Journal article

Embargo date

9999-12-31

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