Show simple item record

Wafer-level packaging for RF passive integration

dc.contributor.authorCarchon, Geert
dc.contributor.authorLinten, Dimitri
dc.contributor.authorDupuis, Olivier
dc.contributor.authorDecoutere, Stefaan
dc.date.accessioned2021-10-16T00:53:13Z
dc.date.available2021-10-16T00:53:13Z
dc.date.issued2005-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10184
dc.sourceIIOimport
dc.titleWafer-level packaging for RF passive integration
dc.typeJournal article
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.source.peerreviewno
dc.source.beginpage60
dc.source.endpage63
dc.source.journalOnBoard Technology
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record