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Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging

dc.contributor.authorChen, Jian
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-16T00:55:55Z
dc.date.available2021-10-16T00:55:55Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10209
dc.sourceIIOimport
dc.titleTheoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage484
dc.source.endpage492
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue3
dc.source.volume28
imec.availabilityPublished - imec


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