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The influence of the package environment on the functioning and reliability of capacitive RF-MEMS switches

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorJourdain, Anne
dc.contributor.authorModlinski, Robert
dc.contributor.authorTilmans, Harrie
dc.contributor.authorPuers, Bob
dc.contributor.authorvan Beek, Joost
dc.contributor.authorvan Spengen, Merlijn
dc.date.accessioned2021-10-16T01:14:05Z
dc.date.available2021-10-16T01:14:05Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10338
dc.sourceIIOimport
dc.titleThe influence of the package environment on the functioning and reliability of capacitive RF-MEMS switches
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorPuers, Bob
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage102
dc.source.endpage116
dc.source.journalMicrowave Journal
dc.source.issue12
dc.source.volume48
imec.availabilityPublished - imec


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