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Passive on-chip components: trends and challenges for RF applications

dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorCarchon, Geert
dc.contributor.authorDehan, Morin
dc.contributor.authorMercha, Abdelkarim
dc.date.accessioned2021-10-16T01:16:14Z
dc.date.available2021-10-16T01:16:14Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10352
dc.sourceIIOimport
dc.titlePassive on-chip components: trends and challenges for RF applications
dc.typeJournal article
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.source.peerreviewno
dc.source.beginpage503
dc.source.endpage513
dc.source.journalMicroelectronic Engineering
dc.source.issue3_4
dc.source.volume82
imec.availabilityPublished - imec
imec.internalnotesProc. 9th Eur. Workshop on Materials for Advanced Metallization; March 2005; Dresden


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