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Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

dc.contributor.authorKobrinsky, M.J.
dc.contributor.authorChakravarty, S.
dc.contributor.authorJiao, D.
dc.contributor.authorHarmes, M.C.
dc.contributor.authorList, Scott
dc.contributor.authorMazumder, M.
dc.date.accessioned2021-10-16T02:37:21Z
dc.date.available2021-10-16T02:37:21Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10716
dc.sourceIIOimport
dc.titleExperimental validation of crosstalk simulations for on-chip interconnects using S-parameters
dc.typeJournal article
dc.source.peerreviewno
dc.source.beginpage57
dc.source.endpage62
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue1
dc.source.volume28
imec.availabilityPublished - imec


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