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Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasma

dc.contributor.authorMannaert, Geert
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorJonas, A.M.
dc.date.accessioned2021-10-16T03:14:30Z
dc.date.available2021-10-16T03:14:30Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/10844
dc.sourceIIOimport
dc.titleMinimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasma
dc.typeJournal article
dc.contributor.imecauthorMannaert, Geert
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage2198
dc.source.endpage2202
dc.source.journalJournal of Vacuum Science and Technology B
dc.source.issue5
dc.source.volume23
imec.availabilityPublished - imec


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