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Ultra-thin benzocyclobutene bonding of III-V dies onto SOI substrate

dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorBaets, Roel
dc.date.accessioned2021-10-16T04:34:58Z
dc.date.available2021-10-16T04:34:58Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11116
dc.sourceIIOimport
dc.titleUltra-thin benzocyclobutene bonding of III-V dies onto SOI substrate
dc.typeJournal article
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.source.peerreviewno
dc.source.beginpage561
dc.source.endpage562
dc.source.journalElectronics Letters
dc.source.issue9
dc.source.volume41
imec.availabilityPublished - imec


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