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Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique

dc.contributor.authorChristiaens, Filip
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoggen, Jean
dc.date.accessioned2021-09-29T14:18:56Z
dc.date.available2021-09-29T14:18:56Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1118
dc.sourceIIOimport
dc.titleEvaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1807
dc.source.endpage1810
dc.source.journalMicroelectronics and Reliability
dc.source.issue11_12
dc.source.volume36
imec.availabilityPublished - open access
imec.internalnotesPaper from ESREF 96 - 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis. October 8-11, 1996. Enschede, The Netherlands.


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