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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

dc.contributor.authorSiau, S.
dc.contributor.authorVervaet, A.
dc.contributor.authorSchacht, E.
dc.contributor.authorCallewaert, K.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorDegrande, S.
dc.date.accessioned2021-10-16T05:01:17Z
dc.date.available2021-10-16T05:01:17Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11197
dc.sourceIIOimport
dc.titleChemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
dc.typeJournal article
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpaged136
dc.source.endpaged150
dc.source.journalJournal of the Electrochemical Society
dc.source.issue9
dc.source.volume152
imec.availabilityPublished - imec


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