dc.contributor.author | Snoeckx, Koen | |
dc.contributor.author | De Moor, Piet | |
dc.contributor.author | De Munck, Koen | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-16T05:14:26Z | |
dc.date.available | 2021-10-16T05:14:26Z | |
dc.date.issued | 2005-04 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11237 | |
dc.source | IIOimport | |
dc.title | 3D Packaging issues for ultrasmall systems-in-a-cube | |
dc.type | Journal article | |
dc.contributor.imecauthor | Snoeckx, Koen | |
dc.contributor.imecauthor | De Moor, Piet | |
dc.contributor.imecauthor | De Munck, Koen | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | S3 | |
dc.source.endpage | S6 | |
dc.source.journal | Solid State Technology | |
dc.source.issue | 4 | |
dc.source.volume | 48 | |
imec.availability | Published - imec | |