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3D Packaging issues for ultrasmall systems-in-a-cube

dc.contributor.authorSnoeckx, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorDe Munck, Koen
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T05:14:26Z
dc.date.available2021-10-16T05:14:26Z
dc.date.issued2005-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11237
dc.sourceIIOimport
dc.title3D Packaging issues for ultrasmall systems-in-a-cube
dc.typeJournal article
dc.contributor.imecauthorSnoeckx, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpageS3
dc.source.endpageS6
dc.source.journalSolid State Technology
dc.source.issue4
dc.source.volume48
imec.availabilityPublished - imec


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